| 发明名称 |
Method for dicing composite wafers |
| 摘要 |
In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.
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| 申请公布号 |
US5369060(A) |
申请公布日期 |
1994.11.29 |
| 申请号 |
US19930070141 |
申请日期 |
1993.06.01 |
| 申请人 |
ROBERT BOSCH GMBH |
发明人 |
BAUMANN, HELMUT;KURLE, JUERGEN;EIBERGER, PETER |
| 分类号 |
B28D5/02;H01L21/301;H01L21/304;H01L29/84;(IPC1-7):H01L21/302 |
主分类号 |
B28D5/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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