| 发明名称 |
Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent |
| 摘要 |
A process for manufacturing a low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed during the fabrication of the bonding interconnect. |
| 申请公布号 |
US5480834(A) |
申请公布日期 |
1996.01.02 |
| 申请号 |
US19930166747 |
申请日期 |
1993.12.13 |
| 申请人 |
MICRON COMMUNICATIONS, INC. |
发明人 |
LAKE, RICKIE C.;TUTTLE, MARK E. |
| 分类号 |
H01L21/60;H01L23/485;H05K3/32;(IPC1-7):H01L21/288 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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