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发明名称
INSPECTING APPARATUS FOR FLIP-CHIP CONNECTING SUBSTRATE
摘要
申请公布号
JPH09211073(A)
申请公布日期
1997.08.15
申请号
JP19960015114
申请日期
1996.01.31
申请人
NEC CORP
发明人
WATANABE SHINJI
分类号
G01R1/06;G01R31/02;G01R31/28;H01L21/60;H01L21/66;(IPC1-7):G01R31/28
主分类号
G01R1/06
代理机构
代理人
主权项
地址
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