| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package that can be miniaturized and has improved electrical characteristics. SOLUTION: A ceramic package consists of an electronic component mounting means 36 provided at a ceramic substrate 3, a covering 1 for cap junction provided around the electronic component mounting means 36, a lead pad 52 for joining a lead 2, and a conductor pattern 5 and a via hole 53 for electrically connecting electronic component 6 mounted to the electronic component mounting part 36 and a lead pad 52. The lead pad 52 is provided at a side opposite to the side where the covering 1 is provided in the ceramic substrate 3. The inner-periphery terminal of the lead pad 52 is provided nearer to the electronic component mount part 36 than to the outer-periphery terminal of the covering 1. |
