| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing device and a processing system, wherein the temperature of an object to be temperature adjusted is controlled uniformily, when the object is subjected to a prescribed processing. SOLUTION: A placement stage 17, on which a wafer 2 is placed, is provided at the lower part of a process chamber 14 of a processing apparatus 5. In the placement stage 17, a temperature-adjusting means 19 for adjusting the temperature of the wafer 2 is provided. The temperature adjusting means 19 is provided with a plurality of arrayed flow channels, a fluid of a specified temperature flowing in the flow channel, and a heat-shielding member 22 provided between flow channels. A fluid is supplied in flow channels 20a and 20b, so that the fluid flowing in the flow channel 20a and that flowing in the flow channel 20b flow in directions different from each other.
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