| 摘要 |
PROBLEM TO BE SOLVED: To ensure a good heat transfer path to a wiring board for a semiconductor element mounted on the wiring board in a flip-chip mounting manner. SOLUTION: A semiconductor element 3 is mounted on a wiring board 1, and the terminal electrode 4 of the element 3 and the opposed electrode pads 2 formed on the surface of the wiring board 1 are connected together into an electronic circuit module with a bonding member composed of metal particles 5 which are 30 to 100μm in diameter and arranged at an interval of 50μm or smaller. Heat released from the semiconductor element 3 can be efficiently transferred to the wiring board 1, and the electronic circuit module can be improved in electric connection reliability. |
