| 摘要 |
PURPOSE:To bond a semiconductor to a thin-film print substrate with a lead-wire fitting pad and a die pad without damaging the lead wire, by temporarily fixing the both and then by tightening up the both by using a set board and a semiconductor container frame which consist a vacuum container. CONSTITUTION:On the top surface of vacuum container 11, exhaust pipe 13 is provided and at the lower end, opening part 12 is made; and set board 14 of fluororesin is hermetically fixed to this opening part 12 by packing 15. This set board is provided with rectangular hollow part 16 a little bit smaller than processed object S with several semiconductors temporarily fixed at the fixed position on the thin- film print substrate via a flux, and stepped hollow frame 17 with buried object 7 is made in contact with the reverse surface of this set board 14. Under this, heat plate 18 whose section is convex is pushed, and this plate and container 11 are tightened up by using screws. In this way, the bonding unit is constituted, and processed object S with the outer lead temporarily fixed to the flux film of the die pad part is taken in frame 17 and heated before being bonded by tightening up all. |
