发明名称 Modular instrument housing accommodating printed circuit boards - consists of premoulded sections and uses exchangeable components to permit universal location
摘要 <p>The modular instrument housing consists of premoulded upper and lower casings (12, 22) which are fixed together by screws to the slid-in side walls (36) and enclose an end panel (44) to form a hollow housing. Adjustable feet control the housing level and a movable U-shaped handle (56) connected to strengthening ribs (58) permits many different housing positions. Horizontal flanges contain internal vertical slots which allow the insertion of various printed circuit boards. The housing can be stacked, suspended from above or inserted into a fixed holder by using exchangeable components.</p>
申请公布号 DE2825372(A1) 申请公布日期 1979.11.22
申请号 DE19782825372 申请日期 1978.06.09
申请人 LA FRANCE CORP. 发明人 A. TETI JUN.,JOSEPH;A. PERONI,PETER
分类号 F16M11/10;G12B9/02;H02B1/04;H02B1/46;H05K5/00;(IPC1-7):G12B9/00 主分类号 F16M11/10
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