| 摘要 |
<p>PURPOSE:To prevent the oxidation and migration of a lead frame by previously forming films on both the side of the lead frame and by sequentially peeling off only films at needed places according to the progress of a manufacturing process. CONSTITUTION:Film 2 bonding to one surface of tab 11 of the lead frame, both sides of which are bonded with plastic films 2 and 3, is peeled off and bonding layer 4 is formed by Au-plating or by bonding Au paste. Next, semiconductor pellet 5 is fixed via the bonding layer. Then, film 2 at the side of pellet 5 of internal lead part 12a at the tab side of lead piece 12 is peeled off. Next, pellet 5 is connected to the exposed part of internal lead part 12a through bonding wire 6. Then, pellet 5, tab 11, internal lead part 12a, and wire 6 are resin-molded by sealing resin 7. Next, films 2 and 3 on both the surfaces of external lead part 12b are peeled off. Consequently, the oxidation of the lead frame can be prevented and migration at the time of Ag or Sn plating can be prevented from occurring.</p> |
