| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP (Chemical Mechanical Polishing) pad with grooves for reducing slurry consumption in particular in the field of CMP. <P>SOLUTION: The polishing pad 100 is for use with a polishing medium having an ideal trajectory imposed by rotation of a polishing pad during use. The polishing pad 100 includes a polishing layer having a polishing surface including a plurality of grooves 108. At least a portion of each of the plurality of grooves 108 has a shape and orientation determined as a function of the trajectory of the polishing medium during use of the pad 100. <P>COPYRIGHT: (C)2008,JPO&INPIT |
