| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which is improved in line edge roughness in the formation of a fine pattern of ≤100 nm, and which is particularly suitable for immersion lithography because it can form a resist film having a high refractive index, and to provide a pattern forming method using the positive photosensitive composition. <P>SOLUTION: The positive photosensitive composition comprises (A) a resin which has a heterocyclic group containing a plurality of sulfur atoms in the cyclic structure, and which is decomposed by the action of an acid to increase solubility in an alkali developer, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation. <P>COPYRIGHT: (C)2008,JPO&INPIT |
