AREA-ARRAY DEVICE ASSEMBLY WITH PRE-APPLIED UNDERFILL LAYERS ON PRINTED WIRING BOARD

摘要

THE INVENTION PROVIDES A METHOD OF ATTACHING AN AREA-ARRAY DEVICE SUCH AS A BUMPED FLIP CHIP TO AN ELECTRICAL SUBSTRATE. AN UNDERFILL MATERIAL IS APPLIED TO A PORTION OF THE ELECTRICAL SUBSTRATE, AND THE UNDERFILL MATERIAL IS HEATED TO AN UNDERFILL-MATERIAL STAGING TEMPERATURE. A BUMPED AREA-ARRAY DEVICE IS PROVIDED, THE BUMPED AREA-ARRAY DEVICE INCLUDING AN INTERCONNECTION SURFACE AND A PLURALITY OF CONNECTIVE BUMPS EXTENDING FROM THE INTERCONNECTION SURFACE. THE INTERCONNECTION SURFACE OF THE BUMPED AREA-ARRAY DEVICE IS POSITIONED ADJACENT THE APPLIED UNDERFILL MATERIAL. THE BUMPED AREA-ARRAY DEVICE) IS HEATED TO ELECTRICALLY CONNECT THE CONNECTIVE BUMPS TO THE ELECTRICAL SUBSTRATE. THE INVENTION ALSO PROVIDES A FLIP-CHIP ASSEMBLY AND A PRINTED WIRING BOARD PANEL WITH PRE- APPLIED UNDERFILL MATERIAL.