| 摘要 |
<p>PURPOSE:To increase the mounting density, by lapping a plurality of lead frames connecting electronic circuit elements via electric insulators, molding it with resin, and using the projected lead chips as external terminals with cutting off. CONSTITUTION:The conduction plate is punched out to obtain the lead frames 12, 13, and the semiconductor ship 8 is die-bonded to the element setting lead chip 6 of one frame 12, and the chip 9 is made with the lead chip 7 of another frame 13, respectively by using conductive resin. Next, the chip 8 and the wire connection lead chip 14 of the frame 12, and the chip 9 and the lead chip 15 are bonded respectively by using the wire 10. After that, the frames 12 and 13 are lapped via the electric insulator 5, they are contained in the metal mold to inject the epoxy resin by remaining the tip of the lead pieces 6, 7, 14 and 15, and low pressure molding is made. Thus, the chips 8 and 9 are unifiedly composed and the resin mold 1 can be obtined.</p> |
