发明名称 BOILING HEAT CONDUCTING WALL MANUFACTURING METHOD
摘要 PURPOSE:To improve electric conductivity of an electric conductive thin plate, proved with numerous penetrating holes by electronic beam processing, by being joined to another electric conductive thin plate. CONSTITUTION:An electric conductive thin plate is provided with many penetrating holes by being processed using electronic beam or laser which takes high energy concentration and is able to control radiating energy, processing position and energy-focusing beam, etc., and then, thus prepared thin plate is joined to another electric conductive thin plate 3.
申请公布号 JPS54142692(A) 申请公布日期 1979.11.07
申请号 JP19780049802 申请日期 1978.04.28
申请人 发明人
分类号 B23K26/00;B23K15/00 主分类号 B23K26/00
代理机构 代理人
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