TSV structures and methods for forming the same

摘要

A device includes a substrate having a front side and a backside, a through-via extending from the backside to the front side of the substrate, and a conductive pad on the backside of the substrate and over the through-via. The conductive pad has a substantially planar top surface. A conductive bump has a non-planar top surface over the substantially planar top surface and aligned to the through-via. The conductive bump and the conductive pad are formed of a same material. No interface is formed between the conductive bump and the conductive pad.

主权项

1. A device comprising:
a substrate comprising a first surface and a second surface under the first surface; a conductive feature extending from the first surface into the substrate, wherein the conductive feature comprises:
a conductive pad extending over the first surface of the substrate, wherein the conductive pad comprises a substantially planar top surface opposite the substrate; anda conductive bump contacting the conductive pad, wherein the conductive bump comprises a non-planar top surface over the substantially planar top surface, and wherein the conductive bump and the conductive pad are formed of a same material.