| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is reduced in thermal resistance by providing a thermal via in a surface of an active part of a semiconductor element in a simple method, and thereby has low thermal resistance.SOLUTION: A semiconductor device includes: a substrate 1; a semiconductor element 2 mounted on one main surface of the substrate 1 through an adhesion layer 3 with an element circuit surface up; an insulation layer 4 sealing the semiconductor element 2 and its periphery; a wiring layer 5 provided in the insulation layer 4; a conductive via 7 provided in the insulation layer 4 and electrically connecting with the wiring layer 5; and a thermal via 6 provided in the insulation layer 4 and thermally connected to the semiconductor element 2. A top surface of the semiconductor element 2 has a nitride film or silicon oxide film 11, and the thermal via 6 is in direct contact with the nitride film or silicon oxide film 11.SELECTED DRAWING: Figure 1 |
