发明名称 MANUFACTURE OF RESINNSEALED TYPE SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To improve the operation by arranging the 1st main electrode, a diode pellet sandwiched between upper and lower soldering material, an insulating cylinder surrounding it, and the 2nd main electrode in a soldering jig by stacking and then by taking them out after fusing soldering material for unitizing. CONSTITUTION:Eelectrode 2 is inserted into the concavity of soldering jig 13 provided with the concavity for the 1st main electrode 1, and insulating cylinder 12 is mounted on electrode 2. Next, soldering material 4a is placed on electrode 2 exposed inside of cylinder 12 and on it, diode pellet 1 and soldering material 5a are mounted being stacked. Afterwards, the 2nd main electrode 3 is mounted while being set in so as to cover the top surfaces of soldering material 5a and cylinder 12 entirely, and soldering materials 4a and 5a are fused in an atmosphere of hydrogen gas to fix electrodes 2 and 3 to pellet 1. Next, the diode after soldering is taken out from jig 13 and sealed with epoxy resin to obtain an intermediate- power diode.</p>
申请公布号 JPS54134977(A) 申请公布日期 1979.10.19
申请号 JP19780043452 申请日期 1978.04.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITOGA KEIJI
分类号 H01L23/04 主分类号 H01L23/04
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