摘要 |
PURPOSE:To improve the detection precision of a junction position by surrounding an IC-chip surface oxide film low in reflectivity with an Al frame high in reflectivity. CONSTITUTION:In addition to pad 13,frame-shaped position detection mark 14 of Al is provided onto surface oxide film 12 of the IC chip, and spot light 15 is caused to strike a part inside of the frame. Film 12 does not reflect light, but one part 141 seems to reflect when striking frame 14. In case of no reflection, the spot light agrees with the center of frame 14. A correct connection can be made by making use of this. |