发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate open defects by making a lead wire width wide in the connection part between an element and an electrode. CONSTITUTION:Connection part 14 of lead wire 13 of a lead frame or a tape carrier is formed wide specially. By this constitution, lead wire 13 can cover electrode 12 sufficiently even in case of lead wire slippage. As a result, open defects can be eliminated without deteriorating connection strength.
申请公布号 JPS54124677(A) 申请公布日期 1979.09.27
申请号 JP19780032697 申请日期 1978.03.20
申请人 发明人
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利