| 摘要 |
PURPOSE:To perform the die bonding with good reproducibility accurately, without requiring specially the alignment of solder material, by forming the concave having specified diameter and depth in the area where solder material is spread on the bottom cover. CONSTITUTION:The concave 3b having a given diameter and depth is formed in the upper surface area of the bottom cover 3 surrounded with the insulator 2 of the semiconductor package 1, the solder material 6 is placed, and the semiconductor pellet 4 is lapped on it and heated under inactive atmosphere. In this case, if the solder material 6 is placed at a location biased from the center in the concave 3b, and if heating is made with this condition, a part of the solder material 6 reaches the closest position and then, flows toward arrows, and it spreads entire the concave. Thus, it is effective to apply this to the die bonding for miniature sized super high frequency semiconductor device.
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