| 摘要 |
PURPOSE:To eliminate defective elements, by screening out the semiconductor chips having weak bonding strength, through the high speed revolution of the assembled substrate mounting semiconductor chips. CONSTITUTION:The case 7 mounting the semiconductor chips 2 is fixed on the surface of board having a curved surface, and it is revolved around the rotary shaft 8 with an arbitrary distance r. When the rotary shaft 8 revolves in high speed, the chips having weak bonding strength, i.e., deficient solderability with the back side of the chip is peeled off. The defective elements can be eliminated. |
