| 摘要 |
A connector for demountably attaching a large scale integrated circuit package to a backpanel includes a base receptacle mounted on the backpanel with contact means therein which are in contact with the backpanel. In the preferred embodiment, the base receptacle is adapted to receive a leadless circuit package therein with the terminals of the package in alignment with the contact means of the base receptacle, and the base receptacle is provided with upstanding headed studs. A cover having apertures formed therein is mounted atop the base receptacle so that lateral movement of the cover relative to the base causes interaction of the studs with the apertures to load the terminals of the circuit package into conductive contact with the contact means of the base receptacle and to demountably lock the cover in place atop the base. A fluid-tight chamber is provided between the cover and the integrated circuit package so that a coolant may be circulated therethrough for dissipating the heat produced during operation of the integrated circuit package.
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