| 摘要 |
PURPOSE:To easily obtain an electrical contact point, etc. by dispersing high m.p. metal particles in a low m.p. metal and melting the low m.p. metal by heating to deposit it on a substrate, thereby binding the particles to the substrate to form a thin film. CONSTITUTION:A mixt. of high m.p. metal particles 1 such as Re and low m.p. metal particles 2 such as gold is mounted on substrate 3 and heated with laser beam, etc. for a short time to melt particles 2 alone, thus forming a worked product consisting of low m.p. and high m.p. metals. Particles 1 are then exposed to the product surface by spray polishing, etc. By this method a high m.p. metal thin film can be formed on substrate 3 in a short time. |
