| 摘要 |
<p>PURPOSE:To establish the semiconductor device which can prevent the damage of semiconductor pellet mounted on the anode tab even with the anode tab used in folded way. CONSTITUTION:In the resin mold type semiconductor device, the mechanical stress exerted to the semiconductor pellet 1 to fold the anode tab 2 can be reduced by constituting the resin-molded part for the anode tab 2 as not flat shape but zigzag plane 9 traversally.</p> |
