| 摘要 |
PURPOSE:External electro draw-out part of the ultra-thin type crystal oscillator and the electrode plate of the circuit substrate are set to oppose to each other and then jointed together, and thus the packing can be simplified for the crystal oscillator. CONSTITUTION:External electrode draw-out part 13 composed of the gold film of under 10 m thick is formed to ultra-thin type crystal oscillator 11, with joint material 15 such as the solder or the like provided on the surface. Electrode pattern 14 is formed on the surface of circuit substrate 12 made of the glass or the like. Oscillator 11 is then adsorbed into hole 16a of tool 16 which is heated 16b up to about 200 deg.C, and then pattern 14 on substrate 12 is jointed to part 13 through coupling of tool 16. In this method, the circuit packing can be performed with no used of the electrode lead wire to simplify the job. Furthermore, the packing area suffices with the space under the oscillator area, thus miniaturizing the oscillator circuit. |
