| 摘要 |
PURPOSE:To enhance positioning precision by demarcating a monitor chip region on the surface of a semiconductor substrate and providing a positioning electrode different from an essential P-type electrode in this region and using a window, which is provided in the insulating film covering the positioning electrode, for positioning of a surface P-type electrode forming mask. CONSTITUTION:One semiconductor substrate 1 provided with PN junction is divided into regions for normal chip A and monitor chip B, and one P-type electorde 2 and two P-type electrodes 2 are fitted to regions A and B respectively. Next, SiO2 film 3 is caused to adhere onto all the surface and is etched to provide open hole 4 and open holes 5 and 6 on electrode 2 of region A and electrode 2 of region B respectively, and Cr layer 7 and Au layer 8 which become the background are laminated and caused to adhere onto holes above. After that, electrode 6 provided with open hole 6 is used as a positioning mask, and a mask pattern is matched with this electrode 6 and is subjected to selective plating. Then, Au layer 9 is formed on the surface, and N-type electrode 10 is caused to adhere onto the reverse face of substrate 1. |
