发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:The titled apparatus which can be easily operated and maintained, by installing the mechanism for guiding the wire into the direction suitable for bonding work, and the mechanism for making displaceable the parts to be bonded in the directions X, Y and Z. CONSTITUTION:The bonding tool 31 is provided with the guide groove 31c connected to the bonding groove 31b installed in the tool's main body 31a. The bonding wire is guided by this guide groove 31c, after being applied with the first bonding, while the bonding tool 31 is going toward the second bonding point. And then, the preparatory bonding point B is temporarily settled between the first bonding point A and the second bonding point B, for instance; the tool 31 is once transferred to this point B and next is transferred to the second bonding point C for finishing the bonding work. Hereby, both of the wires being bonded at each bonding point A and C, become parallel to the direction of axis Y, and are laid in freely bridged style in this interval. Accordingly, the settling of declination in the direction of the wire at the bonding point C against the direction of the wire at the bonding point A becomes unnecessary, so that the operation and maintenance can be easily carried out.
申请公布号 JPS5489958(A) 申请公布日期 1979.07.17
申请号 JP19770156484 申请日期 1977.12.27
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 FUKUDA YUKIHIRO;INOUE KAZUO;KAMITOI HIROSHI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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