| 摘要 |
<p>PURPOSE:To evade the occurrence of peeling by shaping a mold part, provided partially to a header, into a mountain viewed from a plane, by elongating the upper edge of the center part equivalent to the summit of the mountain between a couple of fitting apertures, and by making the part equivalent to the foot to take a circuit along the circumferences of fitting apertures. CONSTITUTION:Fitting aperture 12 is provided to one side edge along the longish direction of header 11 of metal of high thermal conductivity, reinforcement aperture 13 for improving junction with the mold part is to the other edge opposite to it, and reinforcement aperture 14 is also to the center part. Next, semiconductor element 15 to which wire 16 is connected is fitted to the center lower part of header 11, and wire 16 is connected to external lead 18 via lead 17. Then, although resin mold part 19 is formed on header 11, mold part 19 viewed from the plane at this time is shaped into a mountain; the summit part is elongated between apertures 12 and the foot part is along aperture 12 closely. Consequently, no peeling occurs between header 11 and mold part 19.</p> |
