摘要 |
<p>Appts. for ion plasma coating has a discharge chamber, contg. an anode and a hot cathode and having a slit in one wall adjacent the hot cathode, arranged in a vacuum chamber together with a target to be subjected to sputtering, and a holder, for articles to be coated. The target and article holder are arranged in the vacuum chamber on both sides of the plasma flow. A magnetic field is produced to extend through the hot cathode and slit in the discharge chamber wall at a perpendicular to the electric field between the hot cathode and anode. Used in applying thin films of metals, semiconductors, and dielectric materials, onto surfaces of different articles. Placing the cathode and anode in a closed discharge chamber with a slit having a certain gas conductivity makes it possible to separate the discharge and sputtering zones providing optimum pressure conditions to maintain the discharge and ensure high quality film to be produced.</p> |