发明名称 ASSEMBLING METHOD OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the falling of the pellet as well as the lowering of the positional accuracy by giving the pressure to the pellet through the sticking surface to lessen the adhesin intensity between the adhesive tape and the pellet, exfoliating the pellet from by the tape the adhesion intensity of the silver paste and then adhering the exfoliated pellet to the lead side. CONSTITUTION:Pellet 4 which is adhered to adhesive tape 2 on the Al ring with the sticking side put down is positioned on the vertical line at the adhesion part of lead 5. Needle 7 is lowered down to press both the pellet adhering surface and its opposite surface, and thus the pellet is sticked to silver paste 6 on lead 5. With reduction of the contact area at the needle tip, the exfoliating force is exerted to remove the pellet from the tape. When the needle goes up, the pellet is exfoliated from the tape to be sticked onto the silver paste. In this way, the massproductive adhesion becomes possible.
申请公布号 JPS5482976(A) 申请公布日期 1979.07.02
申请号 JP19770150818 申请日期 1977.12.14
申请人 发明人
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
代理机构 代理人
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