发明名称 |
Securing and contacting terminal pins in support plate - uses heating of pins inserted orthogonally in plate bores by current pulses, with simultaneous pin deformation |
摘要 |
<p>The terminal pins to be secured and contacted are fitted with a strip for incorporation in a support plate of a circuit wiring. The pins (2) are set orthogonally through bores in the support plate, heated by a current pulse and mechanically deformed in such manner than an electric contact is formed with the circuit wiring. If a soft solder layer is provided on the wiring, or the pin, the current pulse provides the actual soldering. The device used for the process contains a clamping electrode (6), retaining the terminal pin up to its strip (5). The electrode pushes the pin through the plate bore, while a sprung counter electrode (9) deforms the pin end protruding from the plate.</p> |
申请公布号 |
DE2758190(A1) |
申请公布日期 |
1979.06.28 |
申请号 |
DE19772758190 |
申请日期 |
1977.12.27 |
申请人 |
SIEMENS AG |
发明人 |
THORWARTH,RUEDIGER;DEDERER,GUENTER,ING.;LAESSIGER,ROLF,DIPL.-ING. |
分类号 |
H01R43/02;H05K3/34;(IPC1-7):H01R43/02;H05K13/04 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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