发明名称 Securing and contacting terminal pins in support plate - uses heating of pins inserted orthogonally in plate bores by current pulses, with simultaneous pin deformation
摘要 <p>The terminal pins to be secured and contacted are fitted with a strip for incorporation in a support plate of a circuit wiring. The pins (2) are set orthogonally through bores in the support plate, heated by a current pulse and mechanically deformed in such manner than an electric contact is formed with the circuit wiring. If a soft solder layer is provided on the wiring, or the pin, the current pulse provides the actual soldering. The device used for the process contains a clamping electrode (6), retaining the terminal pin up to its strip (5). The electrode pushes the pin through the plate bore, while a sprung counter electrode (9) deforms the pin end protruding from the plate.</p>
申请公布号 DE2758190(A1) 申请公布日期 1979.06.28
申请号 DE19772758190 申请日期 1977.12.27
申请人 SIEMENS AG 发明人 THORWARTH,RUEDIGER;DEDERER,GUENTER,ING.;LAESSIGER,ROLF,DIPL.-ING.
分类号 H01R43/02;H05K3/34;(IPC1-7):H01R43/02;H05K13/04 主分类号 H01R43/02
代理机构 代理人
主权项
地址