| 摘要 |
PURPOSE:To protect a printed circuit face against contamination and insulation failure by a method wherein not only a hole is bored in a base film but also the base film is plastically deformed by sticking a pin forcibly from a conductive paste side, and upper and lower circuits are electrically connected with each other through the intermediary of the conductive paste. CONSTITUTION:When a pin 3 is forcibly stuck, a flexible conductive paste and base film 1 are plastically deformed by the stress induced on the forced insertion of the pin 3, the terminal end of the flexible conductive paste is exposed at the other face of the base film 1, and the paste is made to flow along a hole bored by the forcible insertion of the pin 3 and its ends protrude from the other face of the base film 1. As mentioned above, the flexible conductive paste is exposed at or protrudes through the other face of the base film due to the deformation of the base film and a circuit 6 is constituted with the same flexible conductive paste, so that upper and lower circuits 2 and 6 are easily and surely electrically connected with each other. |
