| 摘要 |
Particulate, solid, heat-reactive, filler-containing resole molding compositions are directly produced by reacting a phenol, formaldehyde, and an amine in an aqueous medium containing a water-insoluble filler material having reactive sites on the surface thereof which chemically bond with a phenolic resin and protective colloid to produce an aqueous suspension of a particulate filler-containing resole, and recovering the filler-containing resole from said suspension. |
