WERKWIJZE VOOR DE BEREIDING VAN EEN UITHARDBAAR KUNSTSTOF- MENGSEL EN GEVORMDE VOORTBRENGSELEN, VERVAARDIGD ONDER TOEPASSING VAN HET ALDUS BEREIDE MENGSEL.

摘要

The admixing of a small amount of an organosilicon compound containing at least one siliconbonded hydrogen atom per molecule with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices.