| 摘要 |
Heat-curable silicone elastomer compositions are disclosed which comprise a low-viscosity polydiorganosiloxane, free of silicon bonded hydroxy radicals and silicon-bonded hydrolyzable radicals, an organic peroxide, a filler and an alkenyltriacetoxysilane. A process for curing the resulting compositions to provide elastomeric materials having a dry, non-tacky surface is also disclosed. The compositions of this invention have improved adhesion to certain substrates when heat-cured in contact with the substrate and are useful for producing elastomeric seals and gaskets. |
