| 摘要 |
<p>PURPOSE:To improve reliability by preventing the short between a thin wire and lead, by forming an insulating coating on the lead of the intersection between the plate lead and connection thin wire. CONSTITUTION:This device is equipped with a plural number of plate leads 1 to 3 adjacently arranged under the fixed position relation, semiconductor pellet 4 mounted and fixed onto lead 1, and thin wires 5 and 6 electrically connected to leads 2 and 3 and pellet 4, and insulating coating 7 is formed on the surface of lead 3 at the intersection between lead 3 and thin wire 6.</p> |
