发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To perform highly accurate mounting and sealing, by providing the notch or undercut coupled with the alignment means of the pole type tool for the resin sealing head to the bridge of a plurality of leads leading the electrodes through the provision of elements. CONSTITUTION:The lead frames 3 and 4 have the notch 30 and undercut 40 of the bridge parts 32 and 42, and they are coupled with the alignment means 12 of the pole type tool 11. By the lead frame, the mounting and sealing of device can made to the package with high accuracy.</p>
申请公布号 JPS5464466(A) 申请公布日期 1979.05.24
申请号 JP19770130259 申请日期 1977.11.01
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 NOMURA TOORU;YAMADA TAKAMASA
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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