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发明名称
SEALING METHOD OF PACKAGE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPS5462781(A)
申请公布日期
1979.05.21
申请号
JP19770129388
申请日期
1977.10.27
申请人
NIPPON ELECTRIC CO
发明人
SUZUKI KATSUHIKO
分类号
H01L23/02;B23K11/06;B23K11/08;H01L21/50
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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