发明名称 |
PRINTPLAAT, VOORZIEN VAN WEERSTANDELEMENTEN, ALSMEDE WERKWIJZE VOOR HET VERVAARDIGEN VAN DE PRINTPLAAT. |
摘要 |
In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced. |
申请公布号 |
NL7811195(A) |
申请公布日期 |
1979.05.16 |
申请号 |
NL19780011195 |
申请日期 |
1978.11.13 |
申请人 |
NITTO ELECTRIC INDUSTRIAL CO., LTD. TE OSAKA, JAPAN. |
发明人 |
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分类号 |
H01C7/00;H01C7/22;H01C17/06;H01C17/07;H01L27/01;H05K1/16;H05K3/06;(IPC1-7):05K1/16 |
主分类号 |
H01C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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