| 摘要 |
<p>PURPOSE:To prevent any damage or surface stain of a semiconductor wafer due to stress concentration from occurring by a method wherein a semiconductor wafer with the pattern surface thereof turned upward is fed to the bonding surface of a bonding tape while a nozzle blowing off pressure air upon the surface of the semiconductor wafer is relatively scanned thereon to bond the bonding tape onto the surface of the semiconductor wafer. CONSTITUTION:A semiconductor wafer 1 with the pattern surface thereof turned upward is fed to the bonding position by a feeder conveyer 2. A guide roller 3 ls arranged on the bonding position while a bonding tape 4 with bonding surface turned upward is wound-fed at the same level as the conveyer level. Furthermore, on the position immediately above the guide roller 3, a nozzle 5 in width slightly longer than the diameter of the semiconductor wafer 1 is arranged upward at specific interval from the surface of the fed semiconductor wafer 1 to blow off pressure air extending over the whole width of the nozzle 6. Through these procedures, the guide roller 3 feeds the bonding tape 4 at specified low speed while the pressure air is being blown off upon the semiconductor wafer 1 by the nozzle 6 so that the semiconductor wafer 1 may be continuously pressed down from one end to the other end thereof upon the surface of the bonding tape.</p> |
