发明名称 Planar board and card-on-board electronic package assembly
摘要 An electronic package assembly having means for providing direct interconnection for one or more planar electronic circuit boards with a nearly conventional card-on-board circuit package. Electrical interconnection between the card-on-board package and the planar boards is accomplished with the use of interposer cards that utilize a pin and spring blade contact system and printed circuitry to connect corresponding pins on the planar boards and the card-on-board package. The mechanical advantage necessary to overcome the spring contact force encountered in insertion and extraction of the planar boards is provided by a unique lever arrangement which latches and unlatches the planar boards.
申请公布号 US4155109(A) 申请公布日期 1979.05.15
申请号 US19770862083 申请日期 1977.12.19
申请人 INTERNATIONAL BUSINESS MACHINES CORP 发明人 FINCH, LARRY R;ROCHE, JOSEPH D;ROGERS, PAUL M
分类号 H05K7/14;(IPC1-7):H02B1/02 主分类号 H05K7/14
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