| 摘要 |
a semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450 DEG C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass. |
