发明名称 MANUFACTURE OF ELECTRONIC COMPONENT AND DEVICE THEREFOR
摘要 PURPOSE:To use machines with simpler construction and increase the reliability and workability, by connecting leads soldered preparatorily and alone by the use of a pulse heat system, to the external electrodes of an electronic component element. CONSTITUTION:Leads 8 have been soldered preparatorily and alone and taped on ground paper 9 at a constant pitch, and they have been wound on a reel. These leads 8 are sent out to a pulse heat position by sending out the ground paper 9. A capacitor element 7 sucked with a suction nozzle is conveyed to the pulse heat position and inserted between leads 8. In a state of keeping holding the inserted capacitor element 7, sliders 5 are driven and moved from both sides of both leads 8 and hold the leads with the heat chips 1. In that instant large current is made to flow. Then, the ohmic heat generated at the heat chips melts the preparatory solder of the leads 8, and connects them with the external electrodes of the capacitor element 7. After the solder being cooled and hardened, the soldering finishes.
申请公布号 JPH02106916(A) 申请公布日期 1990.04.19
申请号 JP19880259394 申请日期 1988.10.17
申请人 TOSHIBA CORP;MARCON ELECTRON CO LTD 发明人 SAKANIWA MASAO;ABE TAKASHI
分类号 B23K1/00;H01C7/10;H01G4/12;H01G4/228;H01G13/00 主分类号 B23K1/00
代理机构 代理人
主权项
地址