发明名称 ELECTROMAGNETIC SOLID PHASE BONDING METHOD
摘要 PURPOSE:To bond frmly two kinds of metals, by fitting the metals of different kinds, interposing an intermediate metal layer having satin surface between the above metals, passing the high frequency induction current and, in this way, performing the induction heating and electromagnetic pressurization.
申请公布号 JPS5438247(A) 申请公布日期 1979.03.22
申请号 JP19770103625 申请日期 1977.08.31
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 YAMAMOTO TOSHIO;SUZUKI YASUO
分类号 B23K20/06;B23K28/00 主分类号 B23K20/06
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