| 摘要 |
Solid state dual leaf spring transducers are fabricated by batch photolithographic etching techniques from a monocystalline nonmetallic material, such as silicon. Each leaf spring structure includes a leaf spring portion surrounded by a support structure defined by an intervening region of the wafer disposed between adjacent leaf spring structures etched into the wafer. A pair of such leaf spring structures with their respective surrounding support structures are joined together in mutually opposed relation to form a composite dual leaf spring transducer structure of the type wherein a pair of leaf spring structures are mechanically coupled together in axially spaced relation along an axis of sensitivity for equal displacement along said axis of sensitivity in response to displacement of either one of the spring structures relative to the support structure. In one embodiment, a third wafer is interposed between the first two opposed wafers, such third wafer having apertures formed therein so that the leaf spring structures are coupled together through the apertures in the third wafer. In another embodiment, conductive capacitive patterns are formed on the leaf spring structures so as to provide a capacitor structure for sensing displacement of the leaf spring structure.
|
