| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To aboid the deterioration of the dielectric strength by pressure-bonding the element and the solder material containing lead or tin via the Ni layer on the copper plate in order to form a laminated plate electrode.</p> |
| 申请公布号 |
JPS5428582(A) |
申请公布日期 |
1979.03.03 |
| 申请号 |
JP19770094359 |
申请日期 |
1977.08.05 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
FUJII TOSHIYUKI;ONO TAKASHI |
| 分类号 |
H01L29/417;H01L21/60;H01L29/74 |
主分类号 |
H01L29/417 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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