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发明名称
DIE BONDING DEVICE
摘要
申请公布号
JPS5414162(A)
申请公布日期
1979.02.02
申请号
JP19770080255
申请日期
1977.07.05
申请人
SHINKAWA SEISAKUSHO KK
发明人
SUZUKI YASUNOBU;KAWAGISHI MINORU
分类号
H01L21/52;H01L21/58;H01L21/68
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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