发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To manufacture a semiconductor device leaving polybutadiene resin, used as a resist during its manufacture, as an insulation layer and protective layer. |
申请公布号 |
JPS542667(A) |
申请公布日期 |
1979.01.10 |
申请号 |
JP19770067485 |
申请日期 |
1977.06.08 |
申请人 |
FUJITSU LTD |
发明人 |
TAKEDA SHIROU;NAGAI YUUJI;NAKASHIMA MINORU;SUZUKI TAKENORI |
分类号 |
H01L21/312;H01L21/027;H01L21/302;H01L21/31 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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