发明名称 High heat dissipation rectifier assembly - has ribbed heat dissipating plates spaced apart by pillars with staggered rectifier groups
摘要 <p>A rectifier assembly is used for gps. of rectifiers where a considerable amt. of heat is to be dissipated. The assembly is constructed in modular form and evenly distributes the DC flow through heat conducting base plates. Each gp. of rectifiers is mounted on a separate base plate and it is staggered either side of the plate centre line, a further heavy rectangular plate vertical to the base passing over the centre line commoning the remaining rectifier electrodes. Deeply ribbed dissipating surfaces are mounted directly on the base plates and above the gps. spaced by a pair of pillars for each gp.</p>
申请公布号 FR2392498(A1) 申请公布日期 1978.12.22
申请号 FR19760035188 申请日期 1976.11.23
申请人 MOTOROLA SEMICONDUCTEURS 发明人 SERGE LECHAPTOIS ET ROBERT GAY
分类号 H01L23/40;H01L23/495;H01L25/11;(IPC1-7):01L23/36 主分类号 H01L23/40
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