Pellet forming cutter for semiconductor wafer - has split grooved wafer adhesive bonded on foil for easy handling

摘要

The arrangement is for cutting a semiconductor wafer into semiconductor pellets. A foil is adhesive bonded on the rear face of a semiconductor wafer. Grooves are cut in the front face of the wafer for separating the wafer into pellets. The individual pellets are separated from each other by exerting push from the underside of the foil mechanically. The pellets are separated by fracturing. The first adhesive bonded foil can be connected to the second foil held in a frame. A pin is pushed against the rear of the particular pellet from the underside of the second foil.